Recent developments in diffusion bonding – Equipment and applications
For some time now, the use of diffusion bonding technology has been growing significantly every year. Reasons for the increased use nowadays are the capability to join large surfaces without additional filler material and thus to achieve a high joint strength. The joint strength can be as high as the strength of the base material for similar material joints. For corrosion resistance, it is important to have the same material everywhere. In diffusion joining, corrosion resistance is not reduced locally compared to brazing. In addition to the joint properties, the latest developments in the field of diffusion welding systems, such as better process control or higher precision, contribute both to the growth and to the increase in the available capacity in the workshops. Due to changed framework conditions, for example as a result of social or political requirements, existing products have to be adapted (for example scaled) or newly developed. Examples are mobility and energy consumption as well as the increased use of electronic devices. Diffusion bonded parts are used in lithography systems for semiconductor production, for gas cooling during compression or for molding plastic parts for automotive interiors. The paper deals with the recent development of diffusion welding equipment and applications of the solid state joining process “diffusion joining”.
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